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US Patent Issued to DYNEX SEMICONDUCTOR, ZHUZHOU CRRC TIMES SEMICONDUCTOR on July 7 for "IGBT device" (British Inventors)

ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,429, issued on July 7, was assigned to DYNEX SEMICONDUCTOR Ltd. (Lincolnshire, Great Britain) and ZHUZHOU CRRC TIMES SEMICONDUCTOR Co. LTD (H... Read More


US Patent Issued to Semiconductor Manufacturing International (Beijing), Semiconductor Manufacturing International (Shanghai) on July 7 for "Semiconductor structure and forming method thereof" (Chinese Inventors)

ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,430, issued on July 7, was assigned to Semiconductor Manufacturing International (Beijing) Corp. (Beijing) and Semiconductor Manufacturing In... Read More


US Patent Issued to HC Semitek (Zhejiang) on July 7 for "Gallium nitride-based high electron mobility transistor epitaxial wafer with an InGaN/GaN cap layer comprising first sublayers doped with a main doping element and second sublayers doped with the first doping element and an auxiliary doping element, and preparation method therefor" (Chinese Inventors)

ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,431, issued on July 7, was assigned to HC Semitek (Zhejiang) Co. Ltd. (Zhejiang, China). "Gallium nitride-based high electron mobility trans... Read More


US Patent Issued to Murata Manufacturing on July 7 for "FET fin and vertical nanosheet formation using porous semiconductors" (California, Texas Inventors)

ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,432, issued on July 7, was assigned to Murata Manufacturing Co. Ltd. (Kyoto, Japan). "FET fin and vertical nanosheet formation using porous ... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 7 for "Method for forming semiconductor device structure with protection layer" (Taiwanese Inventors)

ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,433, issued on July 7, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Method for forming semiconductor ... Read More


US Patent Issued to Semiconductor Manufacturing International (Shanghai) on July 7 for "Semiconductor structure and fabrication method thereof" (Chinese Inventor)

ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,434, issued on July 7, was assigned to Semiconductor Manufacturing International (Shanghai) Corp. (Shanghai). "Semiconductor structure and f... Read More


US Patent Issued to INTERNATIONAL BUSINESS MACHINES on July 7 for "Co-integrated resonant tunneling diode and high-electron mobility transistor" (Swiss Inventors)

ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,435, issued on July 7, was assigned to INTERNATIONAL BUSINESS MACHINES Corp. (Armonk, N.Y.). "Co-integrated resonant tunneling diode and hig... Read More


US Patent Issued to COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES on July 7 for "Electronic component based on p-doped gallium nitride" (French Inventor)

ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,436, issued on July 7, was assigned to COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES (Paris). "Electronic component based o... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 7 for "Semiconductor structure with blocking layer" (Taiwanese Inventors)

ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,437, issued on July 7, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor structure with bloc... Read More


US Patent Issued to International Business Machines on July 7 for "VTFET with buried power rails" (California, New York, Vermont Inventors)

ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,438, issued on July 7, was assigned to International Business Machines Corp. (Armonk, N.Y.). "VTFET with buried power rails" was invented by... Read More